Cong-Wei Yang

Title: Cong-Wei Yang: Innovator in Semiconductor Packaging Technology

Introduction

Cong-Wei Yang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging technology. His innovative work has led to the development of a unique patent that enhances the structural integrity of package structures.

Latest Patents

Cong-Wei Yang holds a patent titled "Frame edge reinforcement structure for package structures and methods of using the same." This invention includes a device structure that features an interposer with dielectric material layers and metal interconnect structures. It also incorporates semiconductor dies with in-die bonding pads that are bonded to interposer bonding pads through metal-to-metal bonding. The composite die frame surrounds the semiconductor die and includes a molding compound die frame portion along with frame edge reinforcement structures that utilize materials with a lower coefficient of thermal expansion than the molding compound material.

Career Highlights

Cong-Wei Yang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work focuses on advancing packaging technologies that are crucial for the performance and reliability of semiconductor devices.

Collaborations

He collaborates with Tsung-Yen Lee, contributing to the innovative projects at their company. Their teamwork exemplifies the synergy that can lead to groundbreaking advancements in technology.

Conclusion

Cong-Wei Yang's contributions to semiconductor packaging technology through his patent and collaboration with industry professionals highlight his role as an influential inventor. His work continues to impact the field positively.