Company Filing History:

17 out of 164,108

International Business Machines Corporation

1 out of 832,680

Other

patents

where one patent can have more than one assignee

Years Active: 2000-2005

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18 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 6899784 - Apparatus for detecting CMP endpoint in acidic slurries (2005-05-31),

2. 6878629 - Method for detecting CMP endpoint in acidic slurries (2005-04-12),

3. 6506341 - Chemiluminescence detection apparatus (2003-01-14),

4. 6440263 - Indirect endpoint detection by chemical reaction and chemiluminescence (2002-08-27),

5. 6419785 - Endpoint detection by chemical reaction (2002-07-16),

6. 6291351 - Endpoint detection in chemical-mechanical polishing of cloisonne structures (2001-09-18),

7. 6276987 - Chemical mechanical polishing endpoint process control (2001-08-21),

8. 6261851 - Optimization of CMP process by detecting of oxide/nitride interface using IR system (2001-07-17),

9. 6254453 - Optimization of chemical mechanical process by detection of oxide/nitride interface using CLD system (2001-07-03),

10. 6251784 - Real-time control of chemical-mechanical polishing processing by monitoring ionization current (2001-06-26),

11. 6228769 - Endpoint detection by chemical reaction and photoionization (2001-05-08),

12. 6228280 - Endpoint detection by chemical reaction and reagent (2001-05-08),

13. 6194230 - Endpoint detection by chemical reaction and light scattering (2001-02-27),

14. 6180422 - Endpoint detection by chemical reaction (2001-01-30),

15. 6176765 - Accumulator for slurry sampling (2001-01-23),

Title: Innovator Cong Wei: A Leader in Chemical Mechanical Polishing Technology

Introduction

Cong Wei is a prolific inventor based in Poughkeepsie, NY, known for his significant contributions to the field of chemical engineering and mechanical polishing. With an impressive portfolio of 18 patents, his innovations have advanced the understanding and efficiency of chemical mechanical polishing (CMP) processes. His work emphasizes the importance of precision in semiconductor manufacturing and materials processing.

Latest Patents

Among Cong Wei's latest patents, the "Apparatus for detecting CMP endpoint in acidic slurries" stands out. This innovative device is designed to measure ammonia gas concentration during an ongoing CMP cycle utilizing an acidic CMP slurry. Furthermore, he has also developed a complementary method for detecting the CMP endpoint in these acidic slurries, enhancing monitoring capabilities and process optimization in the industry.

Career Highlights

Throughout his career, Cong Wei has held pivotal roles at renowned companies. He has significantly contributed to technological advancements while working at IBM, where he expanded his expertise in semiconductor technologies. Additionally, his tenure at Ecophysics AG allowed him to explore the intersection of chemistry and engineering, further solidifying his status as a leading inventor in his field.

Collaborations

Cong Wei has collaborated with various professionals, notably Leping Li and James Albert Gilhooly. These partnerships have fostered an environment of innovation, allowing for the exchange of ideas and techniques that enhance the effectiveness of CMP processes.

Conclusion

Cong Wei's dedication to innovation in chemical mechanical polishing has made him a key figure in the industry. His 18 patents reflect a commitment to improving technologies that impact semiconductor manufacturing. As he continues to push the boundaries of engineering, his work will likely inspire future advancements in the field.

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