The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2001

Filed:

Aug. 04, 1998
Applicant:
Inventors:

Leping Li, Poughkeepsie, NY (US);

James A. Gilhooly, Saint Albans, VT (US);

Clifford O. Morgan, III, Burlington, VT (US);

Cong Wei, Poughkeepsie, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 4/900 ; B24B 5/100 ;
U.S. Cl.
CPC ...
B24B 4/900 ; B24B 5/100 ;
Abstract

Determination of an endpoint for removing a film from a wafer, by determining a first reference point removal time indicating when a breakthrough of the film has occurred, determining a second reference point removal time indicating when the film has been polished almost to completion, determining an additional removal time indicating an overpolishing interval, and adding the second reference point removal time with the additional removal time to get a total removal time to the endpoint.


Find Patent Forward Citations

Li, Leping. (2001). Chemical mechanical polishing endpoint process control (U.S. Patent No. 6276987). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6276987

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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