Bern, Switzerland

Colin Woratz

This inventor holds 1 USPTO granted patent and 2 published patent applications and 3 EPO patents. Top assignee: Bystronic Laser Ag. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Colin Woratz. Retrieved from https://idiyas.com/inventor/colin-woratz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Colin Woratz - Innovator in Laser Machining Technology

Introduction

Colin Woratz is a notable inventor based in Bern, Switzerland. He has made significant contributions to the field of laser machining technology. His innovative approach has led to the development of advanced machining apparatuses that enhance the efficiency and precision of laser cutting processes.

Latest Patents

Colin Woratz holds 1 patent for his invention titled "Machining apparatus for laser machining a workpiece, method for laser machining a workpiece." This patent describes a machining apparatus designed specifically for laser cutting. The apparatus features a device for generating a machining laser beam, which is essential for rough machining the workpiece. It also includes a mechanism for splitting the machining laser beam into at least two energy intensity ranges. The first energy intensity range is optimized for rough machining, while the second range is intended for fine machining of cut edges.

Career Highlights

Colin Woratz is associated with Bystronic Laser AG, a company renowned for its cutting-edge laser technology solutions. His work at Bystronic has allowed him to apply his innovative ideas in a practical setting, contributing to the advancement of laser machining techniques.

Conclusion

Colin Woratz is a prominent figure in the field of laser machining, with a focus on enhancing the efficiency of laser cutting processes. His patent and work at Bystronic Laser AG reflect his commitment to innovation in this specialized area.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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