Colin P McCann

Title: Innovations by Colin P McCann in Semiconductor Polishing Technologies

Introduction

Colin P McCann is an accomplished inventor based in Pittsburgh, PA (US), known for his contributions to the field of semiconductor polishing technologies. With a total of two patents to his name, McCann has made significant advancements in the preparation and application of silica-based slurries.

Latest Patents

McCann's latest patents include innovative formulations of silica and silica-based slurries. The first patent focuses on a silica composition that includes aggregated primary particles, which is particularly suitable for polishing articles. This invention is especially useful for chemical-mechanical planarization (CMP) of semiconductor substrates and other microelectronic substrates. The second patent also relates to a slurry composition that features a surface modification of silica, enhancing its effectiveness for CMP applications in the semiconductor industry.

Career Highlights

Colin P McCann is currently employed at PPG Industries Ohio, Inc., where he continues to develop and refine technologies that impact the semiconductor manufacturing process. His work has been instrumental in improving the efficiency and effectiveness of polishing techniques used in the industry.

Collaborations

Some of McCann's notable coworkers include Stuart Damon Hellring and Yuzhuo Li, who have collaborated with him on various projects within the semiconductor field.

Conclusion

Colin P McCann's innovative work in silica-based slurries has made a significant impact on the semiconductor industry, showcasing his expertise and dedication to advancing technology. His contributions continue to influence the methods used in microelectronic substrate polishing.