Company Filing History:
Years Active: 2014-2015
Title: Colin McDonough: Innovator in Semiconductor Technology
Introduction
Colin McDonough is a notable inventor based in Albany, NY (US), recognized for his contributions to semiconductor technology. With a total of 2 patents, he has made significant advancements in the integration of through substrate vias and die-to-wafer bonding methods.
Latest Patents
Colin's latest patents include an "Apparatus and method for integration of through substrate vias" and a "Method for thin die-to-wafer bonding." The first patent provides an innovative apparatus that integrates TSVs into devices before processing device contacts. This apparatus features a semiconducting layer, CMOS devices, and bond pads strategically placed for effective bonding. The method outlined in this patent involves several processing steps on a wafer of semiconducting material, ensuring efficient integration of TSVs.
The second patent focuses on a method for bonding a die to a base technology wafer. This method includes providing a device wafer with TSVs, bonding it to a carrier wafer, and processing the device wafer's back side to create a backside redistribution layer. The process culminates in dicing the device wafer into individual die and bonding them to a base technology wafer.
Career Highlights
Colin McDonough is affiliated with the State University of New York, where he continues to push the boundaries of semiconductor research and development. His work has been instrumental in enhancing the efficiency and effectiveness of semiconductor devices.
Collaborations
Colin collaborates with talented individuals such as Daniel Pascual and Jeremiah Hebding, contributing to a dynamic research environment that fosters innovation.
Conclusion
Colin McDonough's work in semiconductor technology exemplifies the spirit of innovation. His patents reflect a commitment to advancing the field and improving device integration methods.