Cody Soule

Title: Cody Soule: Innovator in Through-Silicon Via Technology

Introduction

Cody Soule is an accomplished inventor based in Burlington, VT (US). He has made significant contributions to the field of semiconductor technology, particularly in the area of through-silicon vias (TSVs). His innovative work has led to the development of a unique patent that enhances the efficiency and effectiveness of TSV structures.

Latest Patents

Cody Soule holds a patent titled "Liner-free through-silicon-vias formed by selective metal deposition." This patent describes structures for a through-silicon via and methods of forming such structures. The invention includes a substrate with a trench and surfaces bordering the trench. Additionally, it features a through-silicon via that has a layer inside the trench, which is in direct contact with the substrate surfaces. This innovation is crucial for improving the performance of semiconductor devices.

Career Highlights

Cody is currently employed at GlobalFoundries U.S. Inc., a leading semiconductor manufacturer. His role at the company allows him to apply his expertise in semiconductor technology and contribute to cutting-edge innovations in the industry. His work has been instrumental in advancing the capabilities of TSV technology.

Collaborations

Cody has collaborated with notable colleagues, including David Thomas and John G. Twombly. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Cody Soule is a prominent figure in the field of semiconductor technology, with a focus on through-silicon vias. His patent and contributions to GlobalFoundries U.S. Inc. highlight his commitment to advancing technology in this critical area. His work continues to influence the future of semiconductor design and manufacturing.