Years Active: 2024-2025
Title: Cody Hubman - Innovator in Cooling Systems
Introduction
Cody Hubman is a notable inventor based in Bozeman, MT (US). He has made significant contributions to the field of electronic device cooling systems. With a total of 7 patents to his name, Hubman has demonstrated a commitment to innovation and technological advancement.
Latest Patents
One of Hubman's latest patents focuses on a cooling system designed to enhance the efficiency of electronic devices. This system includes a pump connected to gas accumulators, a heat exchanger, and a core. In various embodiments, the cooling system features a cover that fits securely onto the core, potentially utilizing a thermal fitting. The core is designed with surface channels that facilitate the movement of a working fluid, ensuring optimal cooling performance. Another embodiment emphasizes the importance of a leak-proof seal created by the interference fit of the cover and core, which can be a metal core printed circuit board. This innovative design allows for effective thermal communication with printed circuit boards, enhancing the overall functionality of electronic devices.
Career Highlights
Throughout his career, Cody Hubman has focused on developing advanced cooling solutions for electronic devices. His work has been instrumental in addressing the challenges associated with heat management in technology. Hubman's innovative designs have the potential to significantly improve the performance and longevity of electronic components.
Collaborations
Cody Hubman has collaborated with talented individuals such as Justin Eugene Evans and Shuaib Badat. These partnerships have contributed to the development of his innovative cooling systems and have fostered a collaborative environment for technological advancement.
Conclusion
Cody Hubman is a prominent inventor whose work in cooling systems has made a significant impact on the technology industry. His innovative designs and collaborative efforts continue to push the boundaries of what is possible in electronic device cooling.