The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2025

Filed:

Jun. 25, 2022
Applicant:

Evanswerks, Inc., Milwaukee, WI (US);

Inventors:

Shuaib Badat, Century City, ZA;

Justin Eugene Evans, Milwaukee, WI (US);

Cody Hubman, Bozeman, MT (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/44 (2006.01);
U.S. Cl.
CPC ...
H05K 1/021 (2013.01); H05K 1/0272 (2013.01); H05K 3/44 (2013.01);
Abstract

Disclosed are systems and methods for facilitating the cooling of electronic devices. In one embodiment, a cooling system includes a core having a plurality of surface channels configured to facilitate the transport of a working fluid. The cooling system can include a cover configured to cover the surface channels, and further configured to couple to the core to form a leak proof seal with an interference fit. In some embodiments, the interference fit can be the result of a thermal fitting. The core can be a metal core printed circuit board. The core can be configured to be in thermal communication with a printed circuit board. In certain embodiments, the surface channels are in communication with a fluid inlet and a fluid outlet; the fluid inlet and the fluid outlet can be placed on a side of the core opposite a side of the core having the surface channels.


Find Patent Forward Citations

Loading…