The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2024

Filed:

Jun. 25, 2022
Applicant:

Evanswerks, Inc., Milwaukee, WI (US);

Inventors:

Shuaib Badat, Century City, ZA;

Justin Eugene Evans, Milwaukee, WI (US);

Cody Hubman, Bozeman, MT (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); B23P 15/26 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20418 (2013.01); B23P 15/26 (2013.01); H01L 21/4871 (2013.01); H01L 21/4878 (2013.01); H01L 21/4882 (2013.01); H05K 7/20327 (2013.01); H05K 7/20336 (2013.01);
Abstract

Disclosed are systems and methods for cooling electronic devices. In one embodiment, a method of manufacturing a cooling system includes providing a core having open, fluid channels on a first core side; providing a cover configured to cover the channels, and the cover further configured to couple to the core to form a leak proof seal. In some embodiments, a leak proof seal can be obtained through an interference fit. In certain embodiments, a leak proof seal can be obtained through a thermal fitting. In one embodiment, the core is shrank through cooling and then placed inside the cover. In some embodiments, the cover is expanded through heating and the core is placed inside the cover. In certain embodiments, the core is a metal core printed circuit board. In one embodiment, an electro-osmotic pump, a gas accumulator, and a heat exchanger can be operationally coupled to the channels.


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