Cindy Wailam Chen

Title: The Innovative Contributions of Cindy Wailam Chen

Introduction

Cindy Wailam Chen is a prominent inventor based in San Jose, California. She has made significant contributions to the field of semiconductor technology, particularly in the area of wafer processing. With a total of 2 patents, her work has advanced the methods used in the semiconductor industry.

Latest Patents

Cindy's latest patents include an innovative etch back process approach in dual source plasma reactors. This method involves removing a polysilicon layer from a semiconductor wafer using a downstream plasma source to planarize the wafer. The process effectively removes contours in the polysilicon layer caused by deposition over lithographic features, such as via holes. Following this, exposure to a plasma generated by a direct radio frequency source allows for the bulk etching of the polysilicon, resulting in a planar surface topography with a residual recess height of less than about 10 nm.

Another notable patent pertains to methods for post-polysilicon etch photoresist and polymer removal with minimal gate oxide loss. This invention focuses on cleaning semiconductor wafers by removing polymeric and other residues using dry plasmas generated with microwave, inductively-coupled plasma, and radio frequency energy. The two-step approach provides superior wafer cleaning compared to conventional methods, enhancing the efficiency of semiconductor manufacturing.

Career Highlights

Cindy Wailam Chen is currently employed at Novellus Systems Incorporated, where she continues to innovate in semiconductor processing technologies. Her expertise and contributions have positioned her as a key figure in her field.

Collaborations

Cindy has collaborated with notable colleagues, including Eddie Chiu and Yuh-Jia (Jim) Su, further enhancing her work and contributions to the semiconductor industry.

Conclusion

Cindy Wailam Chen's innovative patents and career in semiconductor technology highlight her significant impact on the industry. Her work continues to pave the way for advancements in wafer processing techniques.