Redondo Beach, CA, United States of America

Cindy S Fietze

This inventor holds 1 USPTO granted patent. Top assignee: Trw Limited. Active years: 2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cindy S Fietze. Retrieved from https://idiyas.com/inventor/cindy-s-fietze

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2002

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Cindy S. Fietze

Introduction

Cindy S. Fietze is a notable inventor based in Redondo Beach, California. He has made significant contributions to the field of multilayer wiring technology. His innovative designs have paved the way for advancements in digital and high-speed interconnects.

Latest Patents

Cindy S. Fietze holds a patent for a multilayer wiring board and multilayer wiring package. This invention comprises a substrate with multiple layers of reinforced resin material, a patterned conductive layer on at least one major surface, and a series of via holes. The design also includes signal carrying wires embedded between the layers of reinforced resin material. The materials used in this invention are typically fiber reinforced, such as glass fiber reinforced epoxy or polyimide. This technology is particularly useful in applications involving integrated circuit chips.

Career Highlights

Cindy S. Fietze is associated with TRW Limited, where he has contributed to various projects involving advanced wiring technologies. His work has been instrumental in enhancing the performance and reliability of electronic devices.

Collaborations

Cindy has collaborated with notable colleagues, including Alexander Krayner and Kenneth C. Selk. Their combined expertise has led to innovative solutions in the field of multilayer wiring.

Conclusion

Cindy S. Fietze's contributions to multilayer wiring technology demonstrate his commitment to innovation and excellence. His patent and collaborative efforts continue to influence advancements in electronic interconnects.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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