The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2002
Filed:
Apr. 20, 1999
William D. Bjorndahl, Torrance, CA (US);
M. David Saferstein, Los Angeles, CA (US);
Alexander Krayner, Sherman Oaks, CA (US);
Cindy S. Fietze, Redondo Beach, CA (US);
Kenneth C. Selk, Hermosa Beach, CA (US);
Rene R. Martinez, Lakewood, CA (US);
William E. McMullen, Redondo Beach, CA (US);
TRW Inc., Redondo Beach, CA (US);
Abstract
A multilayer wiring board comprises a substrate having a plurality of layers of reinforced resin material ′, a patterned conductive layer ′ provided on at least one major surface of the substrate, a plurality of via holes provided at least partly through the substrate, and a plurality of signal carrying wires ′. The signal carrying wires ′ are provided between at least two of the layers of reinforced resin material ′. The signal carrying wires ′ can be embedded in a resin layer ′, and the resin layer ′ sandwiched between a pair of the layers of reinforced resin material. The reinforced resin material is preferably a fiber reinforced resin material, such as a glass fiber reinforced epoxy or polyimide material. In some applications, a constrained core ′, e.g., a copper/ molybdenum/copper laminate, can be provided between a major surface of the substrate and the pair of reinforced resin layers sandwiching the signal carrying wires ′. The board can be used in a multilayer wiring package wherein a plurality of integrated circuit chips are mounted on a major surface of the board . Applications include digital, high-speed digital and RF interconnects.