Sherman Oaks, CA, United States of America

Alexander Krayner

This inventor holds 1 USPTO granted patent. Top assignee: Trw Limited. Active years: 2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Alexander Krayner. Retrieved from https://idiyas.com/inventor/alexander-krayner-d1rzq9cj

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2002

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1 patent (USPTO):Explore Patents

Title: The Innovations of Alexander Krayner

Introduction

Alexander Krayner is an accomplished inventor based in Sherman Oaks, California. He is known for his innovative contributions to the field of multilayer wiring technology. His work has significantly impacted the design and functionality of electronic components.

Latest Patents

Krayner holds a patent for a multilayer wiring board and multilayer wiring package. This invention comprises a substrate with multiple layers of reinforced resin material, a patterned conductive layer on at least one major surface, and a series of via holes. The design includes signal carrying wires embedded between the layers of reinforced resin material, enhancing the board's performance in digital and RF interconnect applications.

Career Highlights

Krayner has made notable advancements in multilayer wiring technology during his career at TRW Limited. His expertise in fiber reinforced resin materials, such as glass fiber reinforced epoxy and polyimide, has led to innovative solutions in high-speed digital applications.

Collaborations

Throughout his career, Krayner has collaborated with talented professionals, including M David Saferstein and Cindy S Fietze. These partnerships have fostered a creative environment that has contributed to the development of cutting-edge technologies.

Conclusion

Alexander Krayner's contributions to multilayer wiring technology exemplify the spirit of innovation in the electronics industry. His patent and collaborative efforts continue to influence advancements in high-speed digital and RF interconnects.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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