This inventor holds 1 USPTO granted patent. Top assignee: Siliconware Precision Industries, Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Ci-Hong Yan and Electronic Package Innovation.
Introduction
Ci-Hong Yan is an inventor based in Taichung, Taiwan. His patent work includes an electronic-package design intended to support miniaturization.
Latest Patents
Yan is associated with 1 patent: “Electronic Package and Manufacturing Method Thereof.” The invention describes an electronic module containing first and second electronic elements, positioned on a carrier structure that embeds a third electronic element. The third element is a photonic chip electrically connected to the module. This arrangement can reduce the carrier structure’s layout area and help meet miniaturization requirements.
Career Highlights
Yan is associated with Siliconware Precision Industries, Ltd. The available information identifies his work in electronic packaging and manufacturing methods.
Collaborations
Meng-Jie Lee and Chih-Nan Lin are identified as Yan’s coworkers. The provided information does not specify their roles in the patent.
Conclusion
Ci-Hong Yan’s patent describes a compact electronic-package configuration that integrates a photonic chip into a carrier structure, contributing to efforts to reduce package size.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile