Company Filing History:
Years Active: 2004-2007
Title: Innovations of Chunhe Gong
Introduction
Chunhe Gong is a notable inventor based in Niskayuna, NY (US). He has made significant contributions to the field of computed tomography and geometric dimensioning and tolerance analysis. With a total of two patents to his name, his work reflects a commitment to advancing technology in these areas.
Latest Patents
Chunhe Gong's latest patents include an "Iterative CT reconstruction method using multi-modal edge information." This innovative method involves an iterative image reconstruction process for CT metrology of an object. The process utilizes accurate forward projection and incorporates prior outer edge information from additional modalities. This approach enhances the quality of reconstructed images and improves the overall accuracy of CT scans.
Another significant patent is the "Method, system and computer product for performing geometric dimension and tolerance stack-up analysis." This method provides a systematic approach to analyzing assembly dimensions by incorporating feature tolerance data. It includes stack-up rules that guide the determination of various tolerances, ultimately resulting in a mean and standard deviation for the target assembly dimension.
Career Highlights
Chunhe Gong is currently employed at General Electric Company, where he applies his expertise in engineering and technology. His work at GE has allowed him to contribute to various projects that leverage his innovative methods in imaging and analysis.
Collaborations
Chunhe has collaborated with notable coworkers such as Qi Zhao and Bruno De Man. These collaborations have fostered an environment of innovation and have led to advancements in their respective fields.
Conclusion
Chunhe Gong's contributions to the fields of computed tomography and geometric dimensioning are noteworthy. His patents reflect a deep understanding of complex engineering challenges and a commitment to innovation. His work continues to influence advancements in technology and engineering practices.