Taichung, Taiwan

Chungchen Hsu

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Winbond Electronics Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chungchen Hsu. Retrieved from https://idiyas.com/inventor/chungchen-hsu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Chungchen Hsu and Semiconductor Manufacturing

Introduction

Chungchen Hsu is an inventor based in Taichung, Taiwan. His patent work includes a method for manufacturing a semiconductor structure, and the supplied information lists one patent associated with him.

Latest Patents

The patent, “Manufacturing Method of Semiconductor Structure,” describes forming a material layer on a substrate and creating two hard-mask patterns above it. The first hard-mask pattern has a ring-shaped top-view outline and an opening. A second hard-mask pattern fills that opening and lies entirely within the first pattern’s outer contour. The patterns are then transferred to the material layer to create a target pattern.

Career Highlights

Hsu is associated with Winbond Electronics Corporation. His listed patent focuses on pattern formation in semiconductor manufacturing.

Collaborations

The supplied information identifies Winbond Electronics Corporation as Hsu’s company but does not specify collaborators or co-inventors for the patent.

Conclusion

Chungchen Hsu’s listed invention presents a hard-mask patterning method for producing a target pattern in a semiconductor material layer, reflecting his connection to semiconductor manufacturing at Winbond Electronics Corporation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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