This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2003.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2003
Title: Innovations of Chung Yi Yu in Multi-Step HDP Deposition Method
Introduction
Chung Yi Yu is an accomplished inventor based in Hsin-Chu, Taiwan, recognized for his significant contributions to the field of semiconductor manufacturing. With one patent to his name, his innovative work focuses on enhancing the efficiency and effectiveness of deposition processes in high aspect ratio trenches.
Latest Patents
Chung Yi Yu's patent titled "Thin Sidewall Multi-Step HDP Deposition Method to Achieve Completely Filled High Aspect Ratio Trenches" is a breakthrough in the semiconductor industry. This multi-step high-density plasma (HDP) deposition and sputtering process is designed to achieve void-free filling of high aspect ratio trenches with stepped cross-sectional profiles. The method proves particularly advantageous for filling trenches formed in triply layered substrates that include a silicon layer, an oxide layer, and a nitride layer. By employing a careful sequence of deposition and sputtering techniques, his invention preserves the nitride layer during the process, ensuring a high-quality fill without damage.
Career Highlights
Currently, Chung Yi Yu is associated with the Taiwan Semiconductor Manufacturing Company (TSMC), a leading entity in the semiconductor fabrication sector. His work not only showcases his technical expertise but also highlights his commitment to advancing manufacturing processes within the industry.
Collaborations
Chung has collaborated with several notable professionals, including Tsung-Hsun Huang and Yeur-Luen Tu, contributing to a rich environment of innovation and collective expertise. These collaborations have further enhanced the development and refinement of semiconductor fabrication techniques.
Conclusion
Chung Yi Yu's inventive spirit and dedication to improving semiconductor technologies stand as a testament to his impact in the field. His patented methods offer solutions that address significant challenges in high aspect ratio trench filling, reinforcing the importance of continuous innovation in the semiconductor manufacturing industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile