Taipei, Taiwan

Chung-Yi Cheng

USPTO Granted Patents = 8 

Average Co-Inventor Count = 2.5

ph-index = 1

Forward Citations = 7(Granted Patents)


Location History:

  • Taichung, TW (2007 - 2009)
  • Taipei, TW (2010 - 2015)
  • New Taipei, TW (2015 - 2020)

Company Filing History:


Years Active: 2007-2020

Loading Chart...
8 patents (USPTO):Explore Patents

Title: Innovations of Chung-Yi Cheng

Introduction

Chung-Yi Cheng is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of chemical-mechanical polishing, holding a total of eight patents. His work focuses on improving the efficiency and effectiveness of polishing processes used in various industries.

Latest Patents

Cheng's latest patents include innovative designs for chemical-mechanical polishing abrasive pad conditioners. One of his notable inventions is a CMP abrasive pad conditioner that features a bottom substrate and an intermediate layer with a hollow portion and an annular portion. This design includes a diamond film that forms abrasive projections, enhancing the polishing process. Another significant patent involves a chemical mechanical polishing conditioner that addresses thermal deformation issues during the curing process, thereby improving surface flatness.

Career Highlights

Throughout his career, Chung-Yi Cheng has worked with notable companies such as Lite-On Technology Corporation and Kinik Company. His experience in these organizations has allowed him to develop and refine his inventions, contributing to advancements in polishing technologies.

Collaborations

Cheng has collaborated with talented individuals in his field, including Jui-Lin Chou and Chia Chun Wang. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Chung-Yi Cheng's contributions to the field of chemical-mechanical polishing are noteworthy, with his eight patents reflecting his dedication to innovation. His work continues to influence the industry and improve polishing processes worldwide.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…