The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2020

Filed:

Jan. 30, 2018
Applicant:

Kinik Company Ltd., Taipei, TW;

Inventors:

Jui-Lin Chou, New Taipei, TW;

Chin-Chung Chou, New Taipei, TW;

Chung-Yi Cheng, New Taipei, TW;

Hsin-Chun Wang, New Taipei, TW;

Yu-Chau Hung, New Taipei, TW;

Assignee:

KINIK COMPANY LTD., Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 53/017 (2012.01); B24B 53/00 (2006.01); B24D 18/00 (2006.01); C08K 3/22 (2006.01); C08K 3/02 (2006.01); C30B 29/36 (2006.01);
U.S. Cl.
CPC ...
B24B 53/017 (2013.01); B24D 18/0009 (2013.01); C08K 3/02 (2013.01); C08K 3/22 (2013.01); C30B 29/36 (2013.01);
Abstract

The present invention provides a CMP abrasive pad conditioner, comprising a bottom substrate; an intermediate layer located on the bottom substrate, the intermediate layer including a hollow portion and an annular portion surrounding the hollow portion, the annular portion being provided with a plurality of bumps; and a diamond film located on the intermediate layer, and forming a plurality of abrasive projections corresponding to the bumps of the intermediate layer; in this case, a top surface of the abrasive projections is formed with a patterned configuration and the top surface is provided with a center line average roughness (Ra) between 2 and 20.


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