Lite-On Technology Corporation

Kinik Company

Chung-Yi Cheng

Jui-Lin Chou

Chia-Feng Chiu

Chung-Yi Lai

Chia Chun Wang

Yu-Jen Su

Ming-Chun Hsu

Wen-Jen Liao

Hsin-Chun Wang

Cheng-Wen Tsai

I-Chung Hou

Chin-Chung Chou

Kai-Hsiang Chang

Yu-Chau Hung

Chia-Chun Wang

The present invention provides a CMP abrasive pad conditioner, comprising a bottom substrate; an intermediate layer located on the bottom substrate, the intermediate layer including a hollow portion and an annular portion surrounding the hollow portion, the annular portion being provided with a plurality of bumps; and a diamond film located on the intermediate layer, and forming a plurality of abrasive projections corresponding to the bumps of the intermediate layer; in this case, a top surface of the abrasive projections is formed with a patterned configuration and the top surface is provided with a center line average roughness (Ra) between 2 and 20.

Chemical-mechanical polishing abrasive pad conditioner and method for manufacturing same

The present invention relates to a chemical mechanical polishing conditioner and manufacturing methods thereof. The chemical mechanical polishing conditioner comprises: a planar substrate having a leveling surface; a bonding layer disposed on the surface of the planar substrate; and a plurality of abrasive particles embedded in the surface of the bonding layer and fixed to the surface of the planar substrate by the binding layer; wherein the planar substrate is formed by a deformation compensation for the non-planar substrate during curing the binding layer, and thus the tips of the abrasive particles have a leveled height. Therefore, the present invention can effectively improve the problem of thermal deformation of the substrate of the chemical mechanical polishing conditioner during heating and curing process, and thereby enhancing the surface flatness of chemical mechanical polishing conditioner.

Chemical mechanical polishing conditioner and manufacturing methods thereof

The present invention relates to a method for manufacturing a chemical mechanical polishing conditioner, comprising: (A) providing a non-planar substrate; (B) providing a binding layer disposed on the surface of the non-planar substrate; (C) providing a plurality of abrasive particles embedded in a surface of the binding layer, and (D) heat curing the binding layer, such that the non-planar substrate is deformed into a planar substrate during curing the binding layer, and the abrasive particles are fixed to a surface of the planar substrate by the binding layer; wherein, after step (D), tips of the abrasive particles have a leveled height. Therefore, the present can effectively improve the problem of thermal deformation of the substrate of the chemical mechanical polishing conditioner during a heat curing process, and enhance surface flatness of the chemical mechanical polishing conditioner.

The present invention relates to a segment-type chemical mechanical polishing conditioner and a method for manufacturing thereof. The segment-type chemical mechanical polishing conditioner comprises: a bottom substrate having a center protrusion; an abrasive unit binding layer disposed on the outside of the surface of the bottom substrate; and a plurality of abrasive units placed on the abrasive unit binding layer; wherein the abrasive units have a fan-shaped contour and are arrange along the center protrusion of the bottom substrate to form a discontinuous circular contour. Therefore, the present invention can utilize the center protrusion of the bottom substrate to adjust the arrangements of the abrasive units, and effectively improve the problem of thermal deformation of the surface of the chemical mechanical polishing conditioner during heat-hardening process, thereby enhancing the surface flatness of chemical mechanical polishing conditioner.

Segment-type chemical mechanical polishing conditioner and method for manufacturing thereof

A fuser assembly for an electrophotographic device includes a tubular roller, a pressing member, a pressing roller, and a heater. The pressing member is disposed in the tubular roller, and includes a tubular part that has a flat surface. The pressing roller presses the tubular roller against the flat surface of the tubular part of the pressing member. The heater is disposed in the tubular part of the pressing member.

Fuser assembly for an electrophotographic device

A multi-function peripheral includes a casing, a scanning module and a printing module. The casing has a recording media path. The scanning module is located on the recording media path for selectively scanning recording media fed into the casing from the recording media path. The printing module also is located on the recording media path for selectively printing the recording media. The recording media are then discharged out of the casing through the recording media path. Thus the multi-function peripheral can reduce the number of elements, simplify replacement of the inkjet cartridge of the printing module, reduce the dimensions, lower the element cost and diminish the complexity of the mechanisms.

Multi-function peripherals

A medium category determination method for a multi-function peripheral, which uses an algorithm to enhance the differences in the luminance values of three primary color and the corresponding standard deviations. The luminance values color and the corresponding standard deviations become precise bases for category determination of unknown media. Caused by the coarseness and the colors on the surfaces of different media, these differences under visible light are easily collected by scanning modules. The method scans the unknown medium to obtain the luminance values of three primary colors, calculates the corresponding standard deviations of all luminance values of the unknown medium, enhances the differences among the luminance values and standard deviations among the unknown medium and multiple known media by an algorithm, and finally determines the category of the unknown medium as the category of one known medium.

Medium category determination method for a multi-function peripheral

A paper tray mechanism that is applicable to machines with paper trays, such as printers, scanners, copiers, fax machines, all-in-one multifunction center and the like, comprises an input paper tray, an output paper tray, where both trays are movable and attached to the machine at sides, and an interconnecting mechanism therein between the two trays. When one paper tray is moved by the user, due to the interconnecting mechanism therein between, another paper tray will automatically move simultaneously. Therefore, this invention provides a paper mechanism that only needs one simple and easy step to have both paper trays unfolded/folded and unstashed/stashed so that some spaces are saved for other usage and machine is compact enough to be repacked into the original box.

Growing community of inventors

Taipei, Taiwan

Chung-Yi Cheng