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For the Inventor, By the Inventor

Hsinchu, Taiwan

Chung-Ping Lai

This inventor holds 31 USPTO granted patents and 14 published patent applications, primarily in LED Technology. Top assignees: Bgt Materials Limited, Graphene Security Limited, Baijie Teng Technology Corporation. Active years: 2015-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chung-Ping Lai. Retrieved from https://idiyas.com/inventor/chung-ping-lai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 31 

% Patents Active = 48.4

Average Co-Inventor Count = 1.7

ph-index = 6

Forward Citations = 101(Granted Patents)


Location History:

  • Shin Jwu Hsien, TW (2015)
  • Zhubei, TW (2016 - 2020)
  • Hsinchu County, TW (2016 - 2021)

Company Filing History:

goldMedal10 out of 11 
 
Bgt Materials Limited
 patents
silverMedal6 out of 6 
 
Graphene Security Limited
 patents
bronzeMedal2 out of 2 
 
Baijie Teng Technology Corporation
 patents
4. 2 out of 2 
 
Graphene Lighting China Limited
 patents
5. 9 out of 834,513 
Other
 patents
where one patent can have more than one assignee

Years Active: 2015-2021

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Areas of Expertise:
LED Lamp
LED Emitter
Heat Dissipation
Polymer Circuit Board
RFID Antenna
Conductive Ink
Wireless Communications
Printed RFID Tag
Battery Regeneration
Hexagonal Boron Nitride
Vehicle Identification
Diaper Monitoring
31 patents (USPTO):Explore Patents
1. 11102891 - Method of manufacturing a polymer printed circuit board (2021-08-24),
2. 10907772 - LED lamp and LED emitter of the same (2021-02-02),
3. 10788164 - LED emitter and LED lamp having the same (2020-09-29),
4. 10782078 - Heat dissipation coating layer and manufacturing method thereof (2020-09-22),
5. 10777859 - Method and apparatus for regenerating battery containing fluid electrolyte (2020-09-15),
6. 10664734 - High-frequency-NFC-based product traceability and anti-counterfeiting tag (2020-05-26),
7. 10600946 - Method of manufacturing a hexagonal boron nitride based laminate on LED filament (2020-03-24),
8. 10561025 - Method of manufacturing polymer printed circuit board (2020-02-11),
9. 10536825 - System for vehicle-to-vehicle identification and detection (2020-01-14),
10. 10349246 - Method and system for vehicle-to-vehicle identification and detection (2019-07-09),
11. 10318857 - Printed RFID sensor tag (2019-06-11),
12. 10283683 - Filament structure and LED light bulb having the same (2019-05-07),
13. 10281129 - Filament structure of LED light bulb (2019-05-07),
14. 10233346 - Conductive ink composition and conductive architecture for wireless antenna (2019-03-19),
15. 10210355 - Combination of RFID antenna and illumination device (2019-02-19),

Title: The Innovative Journey of Inventor Chung-Ping Lai

Introduction: Chung-Ping Lai, a distinguished inventor hailing from Hsinchu County, Taiwan, has made significant contributions to the field of technology and innovation.

Latest Patents: Chung-Ping Lai holds several patents in the areas of semiconductor technology, renewable energy, and advanced materials. His most recent patents focus on enhancing the efficiency of solar cells and improving the performance of electronic devices.

Career Highlights: With a background in electrical engineering, Chung-Ping Lai has had a successful career working for leading technology companies in Taiwan. He has been instrumental in developing cutting-edge technologies that have revolutionized the industry.

Collaborations: Throughout his career, Chung-Ping Lai has collaborated with top researchers, engineers, and scientists from around the world. His collaborative efforts have led to groundbreaking innovations and advancements in various technological fields.

Conclusion: Chung-Ping Lai's passion for innovation and his dedication to pushing the boundaries of technology have established him as a prominent figure in the world of inventors. His work continues to inspire future generations of innovators to think creatively and drive progress in the ever-evolving tech industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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