The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2020

Filed:

Jul. 16, 2018
Applicant:

Bgt Materials Limited, Manchester, GB;

Inventors:

Jingyu Zhang, Huian, CN;

Kuo-Hsin Chang, Chiayi, TW;

Jia-Cing Chen, Tainan, TW;

Chung-Ping Lai, Zhubei, TW;

Assignee:

BGT MATERIALS LIMITED, Manchester, GB;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/64 (2010.01); F21V 29/70 (2015.01); F21V 29/503 (2015.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
H01L 33/641 (2013.01); F21V 29/503 (2015.01); F21V 29/70 (2015.01); H01L 33/642 (2013.01); H01L 33/644 (2013.01); F21Y 2115/10 (2016.08); H01L 2933/0075 (2013.01);
Abstract

A method of manufacturing a hexagonal boron nitride (hBN) laminate on a backside of LED filament contains steps of: a) Preparing a substrate of LED filament array; b) Coating the hBN based slurry on the backside of substrate of LED filament and dried at 100-200° C.; c) Cutting the array to single LED filament. A LED filament with hBN based heat dissipation radiation laminate was obtained after this process. For heat dissipation application, hexagonal boron nitride laminate coating can significantly enhance the performance of LED light bulb.


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