Chung-Ping Hsia

Title: Chung-Ping Hsia: Innovator in Semiconductor Manufacturing

Introduction

Chung-Ping Hsia is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, showcasing his expertise through innovative patent applications.

Latest Patents

Chung-Ping Hsia holds a patent for a "Method for manufacturing semiconductor device." This invention outlines a comprehensive process that includes several steps. The method begins with providing a substrate, a hard mask layer on the substrate, and a first mask pattern on the hard mask layer. The substrate features a device region and a cutting line region. The first mask pattern contains first gaps in the device region and second gaps in the cutting line region. Following this, a spacer layer is conformally applied over the first mask pattern. A second mask pattern is then formed on the spacer layer within the first gaps, ensuring that the top surface of the second mask pattern is lower than that of the first mask pattern. Finally, an etching process is executed to remove the spacer layer between the first and second mask layers and in the second gaps, exposing the hard mask layer.

Career Highlights

Throughout his career, Chung-Ping Hsia has worked with prominent companies in the semiconductor industry. He has been associated with United Microelectronics Corporation and Fujian Jinhua Integrated Circuit Co., Ltd. His experience in these organizations has contributed to his development as an inventor and innovator.

Collaborations

Chung-Ping Hsia has collaborated with talented individuals in his field, including Chien-Hao Chen and Feng-Lun Wu. These collaborations have likely enriched his work and led to advancements in semiconductor technology.

Conclusion

Chung-Ping Hsia is a distinguished inventor whose contributions to semiconductor manufacturing are noteworthy. His innovative methods and collaborations reflect his commitment to advancing technology in this critical field.