Chung-Ping Chien

Title: The Innovator Behind Advanced Multichip Modules: Chung-Ping Chien

Introduction

Chung-Ping Chien, a distinguished inventor based in Redmond, WA, holds an impressive portfolio of five patents that showcase his innovative contributions to the field of multichip modules and optical waveguides. His work has significantly advanced how electronic devices are interconnected and operate.

Latest Patents

Chien's latest patents reflect his commitment to enhancing technology in the field. One notable patent is a fabrication process for multichip modules using a low-temperature bake. This innovative method enables the manufacturing of a multichip module deposited substrate board that utilizes alternating layers of high-density thin-film metal and organic polymer insulating materials. Notably, the insulating material is cured during manufacturing using ultraviolet radiation, ion beam radiation, or electron beam radiation. This approach prevents damage by avoiding temperatures that exceed the recrystallization threshold of the thin-film metal, thereby minimizing warpage, metal interdiffusion, and corrosion at the interface between metal and insulating material. Furthermore, this method allows for the successful production of large-format multichip module deposited substrate boards measuring up to approximately 24 inches square.

Another significant patent pertains to the creation of low loss channel waveguides that utilize doping techniques within dielectric layers in multichip modules. These optical waveguides are crucial for ensuring low optical loss in planar structures. Their design enables efficient interconnections between electronic elements, facilitating high-speed signal transmission that aligns with cutting-edge electronic technologies.

Career Highlights

Chung-Ping Chien's impressive career has seen him work with prominent companies, notably The Boeing Company. His expertise in the domain of electronic systems and materials has made considerable impacts within the industry.

Collaborations

Throughout his career, Chien has collaborated with several talented individuals, including Kishore K Chakravorty and Minas Hagop Tanielian. These partnerships have undoubtedly fueled innovation and contributed to the successful development of Chien's patents.

Conclusion

In conclusion, Chung-Ping Chien exemplifies the spirit of innovation within the field of multichip modules and optical systems. His groundbreaking patents not only advance technological capabilities but also set new standards for manufacturers in the industry. As technology continues to evolve, Chien's contributions will likely remain influential in shaping the future of electronic interconnectivity.