The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 1992
Filed:
Dec. 20, 1990
Applicant:
Inventors:
Kishore K Chakravorty, Mercer Island, WA (US);
Chung-Ping Chien, Redmond, WA (US);
Assignee:
The Boeing Company, Seattle, WA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03C / ;
U.S. Cl.
CPC ...
430330 ; 430315 ; 430318 ; 430329 ;
Abstract
A method of photolithographically patterning a layer of a dielectric composition including a photosensitive polyimide provides patterned dielectric features that have vertical wall profiles that are free of distortions normally associated with high temperature production conditions and shrinkage of the dielectric composition. The method is useful in the production of integrated circuits and high density multiconnect structures.
Chakravorty, Kishore. (1992). Fabrication of microelectronics using photosensitive polyimides (U.S. Patent No. 5124238). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5124238
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile