Company Filing History:
Years Active: 2023
Title: Chung-Nang Chen: Innovator in MEMS Technology
Introduction
Chung-Nang Chen is an acclaimed inventor based in Hsinchu County, Taiwan, recognized for his contributions to micro-electromechanical systems (MEMS) technology. His innovative work has culminated in the award of one patent that showcases his expertise in this cutting-edge field.
Latest Patents
Chung-Nang Chen holds a patent for a "MEMS package and forming method thereof." This patent outlines a MEMS package that consists of a package substrate, a housing structure, an image sensor structure, a MEMS structure, and a composite damper. The innovative housing structure features a stopper, strategically positioning the image sensor structure and MEMS structure between the package substrate and housing. The interconnect wire facilitates electrical connections between the MEMS structure and the image sensor structure, while the composite damper effectively controls the gap between the interconnect wire and the stopper, enhancing functionality and performance.
Career Highlights
Chung-Nang Chen is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he has made significant strides in the field of semiconductor technology and MEMS. His innovations have become a focal point of interest in various technological applications, affirming his status as a leading inventor.
Collaborations
Throughout his career, Chung-Nang Chen has collaborated with notable coworkers, including Shing-Huang Wu and Chia-Wei Liu. These collaborative efforts have enriched his work and contributed to advancements in the semiconductor and MEMS industries.
Conclusion
Chung-Nang Chen's contributions to MEMS technology exemplify the spirit of innovation and dedication to advancement in electronics. His patent reflects a significant leap in the design and functionality of MEMS packages, making a notable impact in the technology sector. As he continues his work at Taiwan Semiconductor Manufacturing Company Limited, the potential for future innovations remains promising.