Chung-Ming Lin

Title: Innovations of Chung-Ming Lin in Trench Isolation Technology

Introduction

Chung-Ming Lin, an accomplished inventor based in Taichung, Taiwan, has made significant contributions to the field of semiconductor technology. With a unique focus on trench isolation methods, he holds three patents that showcase his innovative approach and technical expertise.

Latest Patents

One of Lin's latest patents delves into structures and methods for trench isolation. This patent outlines a silicon-on-insulator (SOI) structure, which comprises several key components: a substrate, a dielectric layer, and a polysilicon region. The substrate consists of a handle layer, an insulation layer arranged over the handle layer, and a buried layer situated above the insulation layer. A trench extends downward from the upper surface of this buried layer, terminating in the handle layer. The dielectric layer is positioned on the bottom surface of the trench, making contact with the handle layer, while the polysilicon region resides within the trench, also in contact with the dielectric layer. This innovative structure enhances the performance and reliability of semiconductor devices.

Career Highlights

Throughout his career, Chung-Ming Lin has worked with prominent companies in the semiconductor industry. He has been affiliated with Taiwan Semiconductor Manufacturing Company Ltd. and MediaTek Corporation. His work in these organizations has played a pivotal role in advancing semiconductor technologies, particularly in trench isolation methods.

Collaborations

Lin's innovative journey has seen him collaborate with talented individuals such as Kuan-Jung Chen and Tsung-Lin Lee. These partnerships have fostered an environment of creativity and innovation, leading to the development of cutting-edge technologies in their respective fields.

Conclusion

Chung-Ming Lin stands out as a notable inventor whose work in trench isolation technology has the potential to significantly impact the semiconductor industry. With his three patents and collaborative efforts, he continues to pave the way for future innovations, solidifying his position as a key player in technological advancements.