Company Filing History:
Years Active: 2016-2022
Title: Innovations of Chung-Hsuan Tsai
Introduction
Chung-Hsuan Tsai is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work focuses on innovative semiconductor package devices and methods of manufacturing them.
Latest Patents
Chung-Hsuan Tsai's latest patents include a semiconductor package device and a semiconductor package structure. The semiconductor package device features a die with an active surface, a back surface, and a lateral surface. It incorporates a first conductive pillar that is electrically connected to the die, along with a dielectric layer that fully covers the lateral surface of the conductive pillar. The package body encapsulates the back surface and the lateral surface of the die. The semiconductor package structure includes a semiconductor die with a conductive bump that electrically couples the die to an external circuit. This structure is encapsulated in a dielectric that contains fillers, ensuring optimal performance.
Career Highlights
Chung-Hsuan Tsai is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor packaging technologies. His expertise and contributions have positioned him as a key figure in the industry.
Collaborations
Chung-Hsuan Tsai has collaborated with notable coworkers, including Chuehan Hsieh and Ya-Yu Hsieh, further enhancing the innovative environment at his workplace.
Conclusion
Chung-Hsuan Tsai's work in semiconductor technology exemplifies the spirit of innovation. His patents and contributions continue to influence the field, showcasing his dedication to advancing semiconductor packaging solutions.