The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2019
Filed:
Apr. 24, 2017
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Chung-Hsuan Tsai, Kaohsiung, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Abstract
A semiconductor package device comprises a die, a dielectric layer, a plurality of conductive pillars and a package body. The die has an active surface, a back surface opposite to the active surface and a lateral surface extending between the active surface and the back surface. The dielectric layer is on the active surface of die, has a top surface and defines a plurality of openings. Each conductive pillar is disposed in a corresponding opening of the plurality of openings of the dielectric layer. Each conductive pillar is electrically connected to the die. Each conductive pillar has a top surface. The top surface of each conductive pillar is lower than the top surface of the dielectric layer. The package body encapsulates the back surface and the lateral surface of the die.