Chung-Hao Lee

Title: Innovations of Chung-Hao Lee in Semiconductor Technology

Introduction

Chung-Hao Lee is a notable inventor based in Chiayi, Taiwan. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approaches to chip packaging.

Latest Patents

One of Chung-Hao Lee's latest patents is a method for fabricating a stacked chip package. This method involves several steps: first, attaching a first semiconductor chip to the upper surface of a substrate using a first adhesive layer. Next, the first adhesive layer is partially cured to a gel state without hardening. Following this, a second semiconductor chip is attached to the first chip through a second adhesive layer. Both adhesive layers are then cured, and the chips are electrically coupled to a structure on the substrate for external connections. Finally, a package body is formed over the chips and a portion of the substrate. This innovative approach allows for the curing of both adhesive layers in a single step, significantly reducing cycle time and production costs.

Career Highlights

Chung-Hao Lee is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop cutting-edge technologies in semiconductor packaging. His work has been instrumental in advancing the efficiency and cost-effectiveness of chip manufacturing processes.

Collaborations

Chung-Hao Lee collaborates with talented coworkers, including Meng-Hui Lin and Tsung-Ming Pai. Their combined expertise contributes to the innovative environment at Advanced Semiconductor Engineering, Inc.

Conclusion

Chung-Hao Lee's contributions to semiconductor technology through his patents and collaborative efforts highlight his role as a key innovator in the industry. His work not only enhances manufacturing processes but also paves the way for future advancements in chip technology.