Taipei, Taiwan

Chung Hao Hsieh

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Sunasic Technologies Limited. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chung Hao Hsieh. Retrieved from https://idiyas.com/inventor/chung-hao-hsieh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Innovations of Chung Hao Hsieh

Introduction

Chung Hao Hsieh is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of technology, particularly in the development of biometric modules.

Latest Patents

Chung Hao Hsieh holds a patent for a Printed Circuit Board Assembly (PCBA) that forms an enhanced biometric module. The patent describes a method for manufacturing the PCBA, which includes providing a PCB, a biometric sensing chip, and surface-mounted devices (SMDs). The process involves mounting the biometric sensing chip on the PCB, linking each bonding pad to a corresponding first contact pad, and forming a protection layer. This invention utilizes the compact size of small conductive elements to prevent cracks in the protection layer.

Career Highlights

Chung Hao Hsieh is currently employed at Sunasic Technologies Limited, where he continues to innovate and develop advanced technologies. His work has been instrumental in enhancing the functionality and reliability of biometric systems.

Collaborations

Chung has collaborated with several talented individuals, including Chi Chou Lin and Zheng Ping He, who have contributed to his projects and innovations.

Conclusion

Chung Hao Hsieh's work in the field of biometric technology showcases his inventive spirit and dedication to advancing technology. His contributions are paving the way for future innovations in this critical area.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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