The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2018
Filed:
Nov. 16, 2015
Applicant:
Sunasic Technologies, Inc., New Taipei, TW;
Inventors:
Assignee:
SunASIC Technologies, Inc., New Taipei, TW;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01); H01L 31/0203 (2014.01); G06K 9/00 (2006.01); H01L 23/14 (2006.01); H01L 23/13 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14609 (2013.01); G06K 9/00006 (2013.01); H01L 23/142 (2013.01); H01L 31/0203 (2013.01); H05K 1/18 (2013.01); H05K 3/30 (2013.01); H01L 23/13 (2013.01);
Abstract
A Printed Circuit Board Assembly (PCBA) for forming an enhanced biometric module and a method for manufacturing the PCBA are disclosed. The method includes the steps of providing a PCB, a biometric sensing chip and SMDs; mounting the biometric sensing chip on the PCB with each bonding pad being electrically linked to one corresponding first contact pad; mounting the SMDs on second contact pads which are electrically linked thereto, respectively; and forming a protection layer. The present invention takes advantages of compact size of small conductive elements to avoid cracks in the protection layer.