This inventor holds 1 USPTO granted patent. Top assignee: Au Optronics Corporation. Active years: 2014.
Company Filing History:
Years Active: 2014
Title: Innovations of Chung-Chuan Wang
Introduction
Chung-Chuan Wang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of substrate technology, particularly through his innovative patent. His work is recognized for enhancing the bonding strength between substrates, which is crucial in various applications.
Latest Patents
Chung-Chuan Wang holds a patent titled "Substrate and substrate bonding device using the same." This invention provides a substrate that includes a base, upper and lower metal layers, and upper and lower covering layers. The base features an upper surface, a lower surface, and a through-hole passing through it. The upper and lower covering layers cover the upper and lower metal layers, respectively. The lower metal layer contains an electrical bonding portion and a strengthening bonding portion that are insulated from each other. The strengthening bonding portion enhances the bonding strength between the substrate and another substrate. The upper metal layer is electrically connected to the electrical bonding portion via the through-hole. The lower covering layer exposes both the electrical bonding portion and the strengthening bonding portion, allowing them to connect with two bonding portions of another substrate.
Career Highlights
Chung-Chuan Wang is associated with AU Optronics Corporation, a leading company in the display technology industry. His work at the company has been instrumental in advancing substrate technology, which is vital for the production of high-quality displays.
Collaborations
Chung-Chuan Wang has collaborated with notable colleagues such as Tzu-Hui Hsu and Chi-Hsiang Huang. Their teamwork has contributed to the development of innovative solutions in the field of substrate technology.
Conclusion
Chung-Chuan Wang's contributions to substrate technology through his patent demonstrate his innovative spirit and dedication to advancing the field. His work continues to influence the industry and pave the way for future advancements.