The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2014
Filed:
Nov. 19, 2010
Chung-chuan Wang, Hsin-Chu, TW;
Chi-hsiang Huang, Hsin-Chu, TW;
Tzu-hui Hsu, Hsin-Chu, TW;
Au Optronics Corp., Hsin-Chu, TW;
Abstract
A substrate and a substrate bonding device using the same are provided. The substrate includes a base, upper and lower metal layers, and upper and lower covering layers. The base has an upper surface, a lower surface and a through-hole passing there through, wherein the upper and lower covering layers respectively covers the upper and lower metal layers respectively disposed on the upper and lower surfaces of the base. The lower metal layer has an electrical bonding portion and a strengthening bonding portion insulated with each other. The strengthening bonding portion enhances the bonding strength between the substrate and another substrate. The upper metal layer is electrically connected to the electrical bonding portion via the through hole. The lower covering layer exposes the electrical bonding portion and the strengthening bonding portion so as to be respectively connected with two bonding portions of the another substrate.