Chune Lee

Title: Chune Lee: Innovator in Multilayer Circuit Board Technology

Introduction

Chune Lee is a prominent inventor based in San Francisco, CA, known for his contributions to the field of multilayer circuit board technology. With a total of 7 patents to his name, Lee has made significant advancements that enhance the efficiency and functionality of electronic devices.

Latest Patents

One of Lee's latest patents is a sequential multilayer process for using fluorinated hydrocarbons. This method involves forming a multilayer circuit board through a build-up process, where alternate layers of conducting metal and dielectric are sequentially deposited. The process utilizes photoresist and photolithographic techniques to define each layer of conducting metal lines. After the lines are deposited, the photoresist is removed, and a second layer of photoresist is used to define conductive posts that function as through holes between metal layers. This innovative approach allows for the creation of complex multilayer wiring boards.

Another notable patent is a system for detachably mounting semiconductors on a conductor substrate. This semiconductor mounting system enables the detachable surface mounting of semiconductor dies on substrates like ceramic or printed circuit boards. It employs a resilient, anisotropic conductor pad that conducts electric signals in one direction while insulating in the other two orthogonal directions. This design not only establishes electrical contact but also enhances heat dissipation, providing a resilient structure for semiconductor protection.

Career Highlights

Chune Lee has worked with several notable companies throughout his career, including Digital Equipment Corporation and Trilogy Computer Development Partners, Ltd. His experience in these organizations has contributed to his expertise in electronic engineering and patent development.

Collaborations

Lee has collaborated with several professionals in the field, including James C Lee and Richard L Beck. These collaborations have likely fostered innovation and the exchange of ideas, further enhancing the quality of his inventions.

Conclusion

Chune Lee's contributions to multilayer circuit board technology and semiconductor mounting systems demonstrate his innovative spirit and technical expertise. His patents reflect a commitment to advancing electronic engineering, making him a significant figure in the field.