Company Filing History:
Years Active: 2019-2020
Title: Innovations by Chun-Yi Cheng
Introduction
Chun-Yi Cheng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of packaging technology, particularly in semiconductor packaging. With a total of 2 patents, his work has advanced the efficiency and effectiveness of electronic components.
Latest Patents
Chun-Yi Cheng's latest patents include innovative package structures and manufacturing methods. The first patent describes a package structure that consists of a redistribution layer, a chip, an encapsulant, an under bump supporting layer, an attachment layer, and solder balls. This design features a patterned circuit layer that is coplanar with the first surface of the redistribution layer, allowing for efficient electrical connections. The encapsulant protects the chip, while the under bump supporting layer includes openings to expose the outer surface of the patterned circuit layer.
The second patent focuses on a package structure that incorporates under ball release layers. This design also includes a redistribution layer, a chip, an encapsulant, and multiple solder balls. The under ball release layers cover the pads of the patterned circuit layer, ensuring reliable electrical connections with the solder balls. These innovations enhance the performance and reliability of semiconductor packages.
Career Highlights
Chun-Yi Cheng is affiliated with the Industrial Technology Research Institute, where he continues to develop cutting-edge technologies in semiconductor packaging. His work has been instrumental in improving the manufacturing processes and performance of electronic devices.
Collaborations
Chun-Yi Cheng collaborates with talented individuals such as Wei-Yuan Cheng and Shu-Wei Kuo. Their combined expertise contributes to the advancement of innovative solutions in the field.
Conclusion
Chun-Yi Cheng's contributions to semiconductor packaging through his patents demonstrate his commitment to innovation and excellence. His work not only enhances the functionality of electronic components but also paves the way for future advancements in technology.