The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2020
Filed:
Aug. 10, 2017
Industrial Technology Research Institute, Hsinchu, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
A package structure includes a redistribution layer, a chip, an encapsulant, an under bump supporting layer, an attachment layer and solder balls. The redistribution layer includes a first surface, a second surface opposite to the first surface and a patterned circuit layer disposed on the first surface, wherein an outer surface of the patterned circuit layer and the first surface are coplanar. The chip is disposed on the second surface and electrically connected to the patterned circuit layer. The encapsulant is disposed on the second surface to encapsulate the chip. The under bump supporting layer is disposed on the first surface and includes openings for exposing the outer surface. The attachment layer covers the inner surface of each opening and the exposed portion of the patterned circuit layer. The solder balls are disposed in the openings respectively and electrically connected to the patterned circuit layer.