This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Tpk Advanced Solutions Inc.. Active years: 2023.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2023
Title: Innovations of Chun-Wei Liu
Introduction
Chun-Wei Liu is a notable inventor based in Miaoli County, Taiwan. He has made significant contributions to the field of electronics, particularly through his innovative patent.
Latest Patents
Chun-Wei Liu holds a patent for a contact structure and an electronic device having the same. The patent describes a contact structure that includes a substrate, a copper layer, an organic composite protective layer, and a silver nanowire layer. The copper layer is disposed on the substrate, while the nanowire-distribution-promotion layer is situated between the copper layer and the silver nanowire layer. This invention aims to enhance the performance and reliability of electronic devices.
Career Highlights
Chun-Wei Liu is currently employed at TPK Advanced Solutions Inc., where he continues to work on innovative technologies in the electronics sector. His expertise and dedication have contributed to the advancement of electronic device design and functionality.
Collaborations
Chun-Wei Liu has collaborated with talented individuals such as Xi-Zhao Wang and Yi-Min Jiang, further enriching his work and expanding the scope of his inventions.
Conclusion
Chun-Wei Liu's contributions to the field of electronics through his innovative patent demonstrate his commitment to advancing technology. His work at TPK Advanced Solutions Inc. and collaborations with other professionals highlight his role as a significant inventor in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile