The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2023
Filed:
Mar. 29, 2021
Applicant:
Tpk Advanced Solutions Inc., Fujian, CN;
Inventors:
Xi-Zhao Wang, Dengzhou, CN;
Yi-Min Jiang, Xiamen, CN;
Li-Wei Mu, Guyuan, CN;
Shan-Yu Wu, New Taipei, TW;
Chao-Hui Kuo, Taipei, TW;
Can-Liang Zhao, Pingdingshan, CN;
Hong-Yan Lian, Xiamen, CN;
Chun-Wei Liu, Miaoli County, TW;
Assignee:
TPK Advanced Solutions Inc., Fujian, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/532 (2006.01); G06F 3/041 (2006.01); G06F 3/044 (2006.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53238 (2013.01); G06F 3/0412 (2013.01); G06F 3/0443 (2019.05); G06F 3/0445 (2019.05); G06F 3/0446 (2019.05); G06F 3/04164 (2019.05); H01L 23/53252 (2013.01); G06F 2203/04103 (2013.01); H01L 31/1888 (2013.01);
Abstract
The present disclosure provides a contact structure and an electronic device having the same. The contact structure includes a substrate, a copper layer, an organic composite protective layer, and a silver nanowire layer. The copper layer is disposed on the substrate. The nanowire-distribution-promotion layer is disposed between the copper layer and the silver nanowire layer.