Chun-Sheng Ho

Title: Innovations by Chun-Sheng Ho in Lead-Free Bump Technology

Introduction

Chun-Sheng Ho is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic components, particularly in the development of lead-free bump technology. His innovative approach addresses the challenges associated with traditional soldering methods.

Latest Patents

Chun-Sheng Ho holds a patent for a process titled "Process for forming lead-free bump on electronic component." This patent outlines a method that includes preparing an electronic component with at least one bond pad and a passivation layer. The process involves forming an under bump metallurgy (UBM) structure on the passivation layer and bond pad, applying a photoresist, depositing a thick copper layer through electroplating, and using a copper-free or low-copper-content solder material. The reflowing procedure allows copper ions to diffuse from the copper layer to the solder material, forming a lead-free bump while preventing damage to the photoresist.

Career Highlights

Chun-Sheng Ho is currently employed at Siliconware Precision Industries Co., Ltd. His work focuses on enhancing electronic component manufacturing processes, particularly in the realm of lead-free technologies. His innovative solutions have contributed to the advancement of sustainable practices in the electronics industry.

Collaborations

Chun-Sheng Ho has collaborated with notable colleagues, including Feng-Lung Chien and Huang-Chuan Chang. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Chun-Sheng Ho's contributions to lead-free bump technology represent a significant advancement in electronic component manufacturing. His innovative processes not only improve product quality but also promote environmentally friendly practices in the industry.