This inventor holds 1 USPTO granted patent. Top assignee: United Microelectronics Corp.. Active years: 2012.
Company Filing History:
Years Active: 2012
Title: Innovations of Chun-Peng Ng in Semiconductor Technology
Introduction
Chun-Peng Ng is a notable inventor based in Singapore, recognized for his contributions to semiconductor technology. His innovative approach has led to the development of a unique method for forming openings in semiconductor substrates, which is crucial for enhancing the performance and reliability of electronic devices.
Latest Patents
Chun-Peng Ng holds 1 patent for his invention titled "Method for forming an opening." This patent describes a process that begins with providing a semiconductor substrate containing at least one metal interconnect. A stacked film is then formed on this substrate, which includes at least one dielectric layer and a hard mask. The hard mask is instrumental in creating an opening in the stacked film without exposing the underlying metal interconnects. After the opening is formed, the hard mask is removed, and a barrier layer is deposited to cover a portion of the dielectric layer and the surface of the metal interconnects.
Career Highlights
Chun-Peng Ng is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His work focuses on advancing semiconductor fabrication techniques, which are essential for the production of modern electronic components.
Collaborations
Chun-Peng Ng has collaborated with several talented individuals in his field, including Shi-Jie Bai and Hong Ma. These collaborations have contributed to the development of innovative solutions in semiconductor technology.
Conclusion
Chun-Peng Ng's contributions to semiconductor technology through his patented methods demonstrate his significant role in advancing the industry. His work continues to influence the development of more efficient and reliable electronic devices.