Company Filing History:
Years Active: 2020-2022
Title: Innovations by Chun Long Li in Wafer Bonding Technology
Introduction
Chun Long Li is a notable inventor based in Hubei, China. He has made significant contributions to the field of semiconductor technology, particularly in wafer bonding methods. With a total of 2 patents, his work has garnered attention for its innovative approaches and practical applications.
Latest Patents
Chun Long Li's latest patents focus on a wafer bonding method and the structures associated with it. The disclosed embodiments detail a process that includes performing a plasma activation treatment on the front surfaces of two wafers. Following this, a silica sol treatment is applied to enhance the bonding surfaces. The method also involves a preliminary bonding process, culminating in a heat treatment that effectively bonds the two wafers together. This innovative approach aims to improve the efficiency and reliability of wafer bonding in semiconductor manufacturing.
Career Highlights
Chun Long Li is currently employed at Yangtze Memory Technologies Co., Ltd. His role at the company allows him to apply his expertise in wafer bonding technology, contributing to advancements in memory chip production. His work is pivotal in enhancing the performance and durability of semiconductor devices.
Collaborations
Chun Long Li collaborates with talented individuals such as Shuai Guo and Jia Wen Wang. Their combined efforts in research and development have led to significant innovations in the field of semiconductor technology.
Conclusion
Chun Long Li's contributions to wafer bonding technology exemplify the importance of innovation in the semiconductor industry. His patents reflect a commitment to advancing manufacturing processes, which ultimately benefits the technology sector as a whole.