Chun Ko

Title: Innovations by Inventor Chun Ko

Introduction

Chun Ko is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of three patents. His work focuses on enhancing the functionality and efficiency of electronic devices through innovative packaging solutions.

Latest Patents

Chun Ko's latest patents include a "Package structure and method for manufacturing the same." This patent describes a package structure that consists of a substrate, a sensor device, an encapsulant, and a signal blocking structure. The substrate features a signal passing area, while the sensor device is positioned above it, with its second surface facing the substrate. The encapsulant covers both the sensor device and the substrate, and the signal blocking structure extends from the substrate into the encapsulant.

Another significant patent is for a "Semiconductor package with integrated optical diffuser and filter." This invention comprises a substrate, an electronic device on the substrate, a lid surrounding the electronic device, and an encapsulant that encapsulates both the electronic device and the lid. The encapsulant contains a plurality of fillers designed to diffuse light interacting with the electronic device, eliminating the need for additional optical filters and diffusers.

Career Highlights

Chun Ko has worked with prominent companies in the semiconductor industry, including Advanced Semiconductor Engineering, Inc. and Sunonwealth Electric Machine Industry Co., Ltd. His experience in these organizations has contributed to his expertise in semiconductor packaging technologies.

Collaborations

Chun Ko has collaborated with several professionals in his field, including Tsu-Hsiu Wu and Wei-Tang Chu. These collaborations have likely enriched his work and led to innovative solutions in semiconductor packaging.

Conclusion

Chun Ko's contributions to semiconductor packaging through his patents demonstrate his innovative spirit and technical expertise. His work continues to influence the industry, paving the way for advancements in electronic device functionality.