Advanced Semiconductor Engineering, Inc.

Sunonwealth Electric Machine Industry Co., Ltd.

Chun Ko

Tsu-Hsiu Wu

Alex Horng

Meng-Jen Wang

Wei-Tang Chu

A package structure is provided. The package structure includes a substrate, a sensor device, an encapsulant and a signal blocking structure. The substrate has a signal passing area. The sensor device is disposed over the substrate. The sensor device has a first surface, a second surface opposite to the first surface and a sensing area located at the second surface. The second surface of the sensor device faces the substrate. The encapsulant covers the sensor device and the substrate. The signal blocking structure extends from the substrate into the encapsulant.

Package structure and method for manufacturing the same

A semiconductor package is provided in the present disclosure. The semiconductor package comprises: a substrate, an electronic device disposed on the substrate, a lid disposed on the substrate and surrounding the electronic device an encapsulant formed over the substrate, encapsulating the electronic device and the lid; and a plurality of fillers in the encapsulant, configured to diffuse light interacting with the electronic device. In this way, through the use of the encapsulant including the fillers distributed therein, additional optical filters and diffusers are not needed. Also, through the use of the lid, undesired stray light can be prevented from being interacting with the electronic device.

Semiconductor package with integrated optical diffuser and filter

An air exchange device improves the covering effect and the overall visual effect on the appearance of the air exchange device along with a divider where the air exchange device is mounted. The air exchange device includes an air-guiding tube and a covering member. The air-guiding tube has a first maximal outer diameter, and includes a first end and a second end. The covering member includes a positioning portion that is adapted to be coupled to an outer wall of the air-guiding tube, and a covering portion connected to the positioning portion. The covering portion has a second maximal outer diameter larger than the first maximal outer diameter of the air-guiding tube.

Growing community of inventors

Kaohsiung, Taiwan

Chun Ko