Chun-I Liao

Title: Innovations by Chun-I Liao in Conductive Structures

Introduction

Chun-I Liao is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the fabrication of conductive structures. His innovative approaches aim to enhance the reliability and performance of electronic devices.

Latest Patents

Chun-I Liao holds a patent for "Conductive structures and methods of fabrication thereof." This patent focuses on methods of fabricating conductive features to prevent metal extrusion. The invention includes a control layer designed to reduce the grain size of a metal-containing layer, resulting in a robust structure that decreases extrusion defects. In some embodiments, the control layer is strategically formed between a barrier layer and the conductive feature. Additionally, the control layer can be created by adding a control element, such as oxygen, to the upper portion of the barrier layer. This innovative approach addresses critical challenges in semiconductor manufacturing.

Career Highlights

Chun-I Liao is currently employed at Taiwan Semiconductor Manufacturing Company Ltd. His work at this leading semiconductor manufacturer has allowed him to apply his expertise in developing advanced technologies that are essential for modern electronics.

Collaborations

Chun-I Liao has collaborated with talented colleagues, including Jun-Nan Nian and Yao-Hsiang Liang. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Chun-I Liao's contributions to the field of conductive structures exemplify the importance of innovation in semiconductor technology. His patent addresses significant manufacturing challenges and showcases his commitment to advancing the industry.