Taiwan Semiconductor Manufacturing Comp. Ltd.

Chun-I Liao

Yao-Hsiang Liang

Jian-Shin Tsai

Jun-Nan Nian

Ming-Ching Chung

Embodiments of the present disclosure relate to methods of fabricating conductive features to prevent metal extrusion. Particularly, the conductive feature includes a control layer to reduce grain size of a metal containing layer, thus obtaining a robust structure to decrease extrusion defects. In some embodiments, the control layer is formed between a barrier layer and the conductive feature. In some embodiments, the control layer is formed by adding a control element, such as oxygen, to an upper portion of the barrier layer.

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Tainan, Taiwan

Chun-I Liao