This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2011.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2011
Title: Innovations of Chun-Hung Hsu in Semiconductor Packaging
Introduction
Chun-Hung Hsu is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative designs and methods. His work has been recognized for enhancing the efficiency and reliability of packaging solutions in the semiconductor industry.
Latest Patents
Chun-Hung Hsu holds a patent for a "Semi-finished package and method for making a package." This invention relates to a semi-finished package that includes a carrier and at least one molding compound. The molding compound is strategically placed on the surface of the carrier and features a body with multiple outer protrusions. These protrusions are located at the periphery of the body and are designed to be taller than the body itself. This design increases the rigidity of the semi-finished package, effectively addressing the warpage issues caused by differing thermal expansion coefficients between the molding compound and the carrier. As a result, the yield rate of the package unit is significantly improved.
Career Highlights
Chun-Hung Hsu is associated with Advanced Semiconductor Engineering, Inc., a leading company in the semiconductor packaging industry. His role in the company has allowed him to apply his innovative ideas and contribute to advancements in packaging technology. His patent reflects his commitment to improving product quality and manufacturing processes.
Collaborations
Chun-Hung Hsu has collaborated with notable colleagues such as Kuang-Hsiung Chen and Ren-Yi Cheng. Their teamwork has fostered an environment of innovation and creativity, leading to advancements in semiconductor packaging solutions.
Conclusion
Chun-Hung Hsu's contributions to the field of semiconductor packaging through his innovative patent demonstrate his expertise and commitment to enhancing technology. His work not only improves product reliability but also increases manufacturing efficiency.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile