This inventor holds 4 USPTO granted patents and 2 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2020-2026.
Company Filing History:
Years Active: 2020-2026
Title: Innovations of Chun Huan Wei
Introduction
Chun Huan Wei is a notable inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the development of advanced capacitor structures. With a total of three patents to his name, his work has had a considerable impact on the industry.
Latest Patents
One of Chun Huan Wei's latest patents involves a method of manufacturing a three-dimensional (3D) metal-insulator-metal (MIM) capacitor in the back end of line. This innovative approach provides large and tunable capacitance values while ensuring that it does not interfere with the existing back-end-of-line (BEOL) fabrication process. The method includes several steps, such as forming conductive features on a semiconductor substrate, creating via structures, and establishing metallization structures that are conductively coupled to the features. This patent exemplifies his commitment to enhancing semiconductor device fabrication.
Career Highlights
Chun Huan Wei is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His role at the company allows him to apply his inventive skills and contribute to cutting-edge technology development. His expertise in semiconductor manufacturing processes has positioned him as a valuable asset to his team.
Collaborations
Throughout his career, Chun Huan Wei has collaborated with talented individuals, including his coworkers Pin Yu Hsu and Szu