This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Chun-Hsien Wen: Semiconductor Interconnect Invention
Introduction
Chun-Hsien Wen is an inventor associated with Taoyuan, Taiwan, and Taiwan Semiconductor Manufacturing Company Limited. His patent work concerns semiconductor connection structures designed to support electrical connections between vias.
Latest Patents
Wen is credited with 1 patent: “Via Connection Structure Having Multiple Via-to-Via Connections.” The invention describes a conductive structure positioned between and electrically contacting multiple via structures. The vias are laterally offset from neighboring vias rather than stacked, and conductive traces and footprints connect each via electrically to at least two other vias on the same device level.
Career Highlights
Wen’s listed patent reflects work on semiconductor interconnect design and manufacturing methods. Its laterally offset via arrangement provides an alternative to stacked-via connections within a semiconductor device.
Collaborations
Wen’s listed coworkers include Ting-Yu Yeh and Shu-Cheng Li. The patent is associated with Taiwan Semiconductor Manufacturing Company Limited.
Conclusion
Chun-Hsien Wen’s patent contribution focuses on a semiconductor connection structure that links multiple laterally offset vias through conductive features.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile